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This is a machine for pick &amp; place and bonding technology. This pick &amp; place machine is clip mounted and the minimum size is 0201. It is IC mounted and the fine pitch is in 0.3mm of QFP. The BGA or micro BGA has a diameter of 0.4mm with a 0.8mm pitch. Diameter of the ball is 0.3mm and it comes with a 0.5mm pitch CSP.
 <ul><li>Bonding Technology: aluminium wire bonding</li><li>Flip chip bonding: ACF, C4 and C5 Technology</li><li>Convenient to operate</li></ul>

<ul style="margin-left: 17px;">
	<li>Chip mount</li>
	<li>Minimum size is 0201</li>
	<li>IC mount</li>
	<li>Fine pitch in 0.3 mm of QFP</li>
	<li>BGA / Micro BGA</li>
	<li>Dia. 0.4mm with 0.8mm pitch; Dia. 0.3mm ball with 0.5mm pitch CSP</li>
</ul>

Showcased is a power supply designed for&nbsp;printers. It provides stable power current with over-current and under-current control. Made of high-quality material, this power supply promises excellent structural strength.
<ul>
 <li>Designed for printers.</li>
 <li>Available in different designs.</li>
</ul>

<ul style="margin-left:17px;padding-left:0;"><li type="DISC">Dust-free or 1K clean room</li><li type="DISC">LCD module production</li><li type="DISC">Electronic Manufacturing Service (EMS)</li><li type="DISC">SMT</li><li type="DISC">Contract Manufacturing (CM)</li><li type="DISC">PCB Assembly (PCBA)</li><li type="DISC">OEM</li><li type="DISC">ODM</li><li type="DISC">Manual insertion</li><li type="DISC">Complete product</li><li type="DISC">Design verification</li><li type="DISC">Parts procurement</li><li type="DISC">Product testing</li></ul>

<img src="https://sourcing-media.hktdc.com/product/7879185ee39d11ea883f06c82c63b760/7e1a36e3e39d11ea883f06c82c63b760" class="fr-fic fr-dib" data-strproductmediaid="18720517e39e11ea883f06c82c63b760">

This high-tech machine is designed for advanced pick-and-place and bonding technology. It supports chip mount&nbsp;with the minimum size of 0201 and IC mount with fine pitch in 0.3mm of QFP. The BGA or micro BGA has a diameter of 0.4mm with a 0.8mm pitch or a diameter of 0.3mm ball with 0.5mm pitch CSP.
<ul>
 <li>Flip Chip Bonding: ACF, C4 and C5 Technology.</li>
 <li>Aluminum wire bonding.</li>
</ul>

<img src="https://sourcing-media.hktdc.com/product/787918fae39d11ea883f06c82c63b760/7e1a3eeee39d11ea883f06c82c63b760" class="fr-fic fr-dib" data-strproductmediaid="187205b9e39e11ea883f06c82c63b760">

Our research and development service focuses on switching-mode power and micro controller. We produce standard-design products with high quality, function, and precision. We also engage in providing tailor-designed electronic solutions and upgrade of OEM products.
<ul>
 <li>Structured systems for great efficiency.</li>
 <li>With advanced facilities and equipments.</li>
</ul>

<img src="https://sourcing-media.hktdc.com/product/78791966e39d11ea883f06c82c63b760/7e1a3fffe39d11ea883f06c82c63b760" class="fr-fic fr-dib" data-strproductmediaid="18720614e39e11ea883f06c82c63b760">

The high-tech soldering service comes with great quality, efficiency and function. Over 80% of the surface-mount technology (SMT) lines are lead-free and comply with RoHS standards. It is a&nbsp;prompt and environmentally-friendly option&nbsp;for refined soldering.
<ul>
 <li>Structured system ensures precise operation.</li>
 <li>With advanced facilities and equipments.</li>
</ul>

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