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Extreme Weather Arrangement
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Circuit Board
Surface Mount Technology Ltd.
Hong Kong
Booth:
5B-B09
| Printed Circuit Board & EMS
Product Specification
Product Description
Chip mount
Minimum size is 0201
IC mount
Fine pitch in 0.3 mm of QFP
BGA / Micro BGA
Dia. 0.4mm with 0.8mm pitch; Dia. 0.3mm ball with 0.5mm pitch CSP
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